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The State-of-the-Art Thermal Compound, Ultimate Heat Conductivity, Non-Electrical Conductive, Ultra-Durable & Non-Curing, No Bleeding & User
The State-of-the-Art Thermal Compound, Ultimate Heat Conductivity, Non-Electrical Conductive, Ultra-Durable & Non-Curing, No Bleeding & User
GC-4 THERMAL PASTE
Best CPU thermal paste in 2024, from budget to mid-range & high-end
GC-4 Thermal Paste 3.5gr
Density (g/cm): 2.30 Viscosity (Poise): 1000 Working Temperature (°C): -30~150 Net Content: 1g, 3.5g, 10g (Link)
Gelid Gc-4 Thermal Paste 1gr 35gr - 1gr
Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission
Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
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