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Enermax ETC521 thermal compound features high thermal conductivity, no electrical conductivity and no corrosive property. Easily apply it on your CPU to transfer more heat from your CPU to the base plate of the heat sink you installed. It comes in a small resealable syringe and once applied, it can be used for years. I
Enermax ETC521 thermal compound features high thermal conductivity, no electrical conductivity and no corrosive property. Easily apply it on your CPU to transfer more heat from your CPU to the base plate of the heat sink you installed. It comes in a small resealable syringe and once applied, it can be used for years. It is the go-to choice for gamers and overclockers.
Optimized polymer matrix to help reduce pump out
Flowable
Good thermal conductivity
Low thermal resistance
Non-curing, no need for curing ovens
Heat removal from electronics components
Can achieve thin Bond Line Thickness (BLT)
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Enermax ETC521 Thermal Compound 3.0g
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Термопасти і аксесуари для систем охолодження - Комп`ютерні комплектуючі
Enermax ETC521 Thermal Compound 3.0g